Performance introduction：

【Product model：RD5020】   

    1、In the BGA area, heating up and down the hot air to simulate the effect of full hot air reflow soldering.

    2、Large area infrared preheating to prevent warpage of PCB.

    3、The alignment system can be left, right, front and back movement; two color image, each point zoom image clear.

    4、The placement position can be programmed and the repeatability is 10um.Automatic tracking heating process, heating process curve drawing.

    5、Real time display of heating period.

    6、The temperature and distance parameters can be programmed to save the number of groups.

    7、Profile curve can be tested, analyzed, printed and saved.High definition video capture, image files can be saved, BMP or JPG files, easy to call analysis.

    8、Easy to learn and easy to operate, all the computer can be set to complete.

    9、Upper and lower air flow separate regulation.

    10、The upper and lower hot air heater in the total of 8 independent heating wire. The uniform temperature performance and fast temperature response of the BGA region were improved.

    11、Different sizes of BGA, top and bottom heat can be replaced by different sizes of nozzles.

    12、PCB in the splint, along the X, Y direction can be quickly moved, but also fine tuning.

    13、A variety of plywood interchangeable, suitable for different shapes of PCB.

parameter list：