Performance introduction:

[product model: RD5030S]  

1、Touch screen operation interface, easy to use;

2、Welding position, mounting position, position and so on can be programmed memory

3、he utility model is characterized in that the three heating zones are suitable for the lead-free process, and the first heating zone and the second heating zone heater are provided with excellent heating materials to generate high temperature breeze，

4、Optical alignment system uses special prism with high precision AF CCD. The user can observe both BGA (CSP) chip bottom solder ball and PCB board BGA (CSP) pad 2 images overlap, through the nozzle to rotate along the X axis and Y chip and the precise displacement angle, and ensure the precision of the chip pad。

5、PLC control, high temperature control precision, stable and reliable performance;

6、Three independent heating zone, suitable for lead-free process, first heating zone, second heating zone heater using good material, high temperature breeze, third heating zone adopts infrared preheating area, prevent the deformation of PCB plates;

7、The upper heating system can move up and down, and the lower heating system can move up and down, which is convenient to adjust;

8、The utility model has the function of sound prompting, after the heating is finished, the PCB plate is cooled by a large flow constant current fan to prevent the deformation of the PCB plate and ensure the welding effect；

9、With a special card tooling, suitable for various shapes of the motherboard；

10、Equipped with a variety of hot air nozzle, or customized according to special requirements；

parameter list：